Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect

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Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect

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Authors

Abdullah Aljaafari

Nagih M. Shaalan

Shalendra Kumar

Abdullah Alsulami

Dataset

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Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect

(MDPI AG, 2023) Abdullah Aljaafari; Faheem Ahmed; Nagih M. Shaalan; Shalendra Kumar; Abdullah Alsulami

URI

https://tustorage.ulb.tu-darmstadt.de/handle/tustorage/3860

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