Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect

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dc.contributor.authorAbdullah Aljaafari
dc.contributor.authorFaheem Ahmed
dc.contributor.authorNagih M. Shaalan
dc.contributor.authorShalendra Kumar
dc.contributor.authorAbdullah Alsulami
dc.date.accessioned2024-08-14T12:55:29Z
dc.date.available2024-08-14T12:55:29Z
dc.identifier.urihttps://tustorage.ulb.tu-darmstadt.de/handle/tustorage/3860
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.subject.ddc540
dc.titleEnhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect
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relation.isDatasetOfDistribution.latestForDiscovery21b7d8c0-6eac-4ef0-9b35-91537e85b7b3

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