Statistics for Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect
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| Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect | 0 |
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| December 2024 | 0 |
| January 2025 | 0 |
| February 2025 | 0 |
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| April 2025 | 0 |
| May 2025 | 0 |
| June 2025 | 0 |
File Visits
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| inorganics-11-05-00204.xml | 1 |