Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect
Description
Toolbox-ID
jz000076-0232
Identifier(s)
https://tustorage.ulb.tu-darmstadt.de/handle/tustorage/3858
Publisher
MDPI AG
License
https://creativecommons.org/licenses/by/4.0/
Subject(s)
DDC(s)
540