Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect

Description

Toolbox-ID

jz000076-0232

Identifier(s)

https://tustorage.ulb.tu-darmstadt.de/handle/tustorage/3858

Publisher

MDPI AG

License

https://creativecommons.org/licenses/by/4.0/

Subject(s)

DDC(s)

540

Distribution(s)

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Distribution
Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect
Abdullah Aljaafari; Faheem Ahmed; Nagih M. Shaalan; Shalendra Kumar; Abdullah Alsulami
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Distribution
Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect
Abdullah Aljaafari; Faheem Ahmed; Nagih M. Shaalan; Shalendra Kumar; Abdullah Alsulami