Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect

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datacite.relatedItem.firstPage204
datacite.relatedItem.issue5
datacite.relatedItem.relatedIdentifierTypeISSN
datacite.relatedItem.relatedItemIdentifier2304-6740
datacite.relatedItem.relationTypeIsPublishedIn
datacite.relatedItem.titleInorganics
datacite.relatedItem.volume11
dc.contributor.authorAbdullah Aljaafari
dc.contributor.authorFaheem Ahmed
dc.contributor.authorNagih M. Shaalan
dc.contributor.authorShalendra Kumar
dc.contributor.authorAbdullah Alsulami
dc.date.accessioned2024-08-14T12:55:28Z
dc.date.available2024-08-14T12:55:28Z
dc.date.issued2023
dc.identifier.doihttps://doi.org/10.3390/inorganics11050204
dc.identifier.otherjz000076-0232
dc.identifier.urihttps://tustorage.ulb.tu-darmstadt.de/handle/tustorage/3858
dc.publisherMDPI AG
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.subject.ddc540
dc.titleEnhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect
dc.typeArticle
dcat.distribution.pdfhttps://tustorage.ulb.tu-darmstadt.de/handle/tustorage/3859
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