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Distributionen
MDPI AG
Periodika
Inorganics
2023
Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect
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Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect
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pdf
Authors
Abdullah Aljaafari
Faheem Ahmed
Nagih M. Shaalan
Shalendra Kumar
Abdullah Alsulami
Journal ISSN
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Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect
(
MDPI AG
,
2023
)
Abdullah Aljaafari
;
Faheem Ahmed
;
Nagih M. Shaalan
;
Shalendra Kumar
;
Abdullah Alsulami
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URI
https://tustorage.ulb.tu-darmstadt.de/handle/tustorage/3859
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inorganics-11-05-00204.pdf
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