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Multi-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging
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pdf
Authors
Boyan Yu
Yisai Gao
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Multi-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging
(
MDPI AG
,
2022
)
Boyan Yu
;
Yisai Gao
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URI
https://tustorage.ulb.tu-darmstadt.de/handle/tustorage/1601
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chips-01-03-00013.pdf
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