Multi-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging
Description
Toolbox-ID
jz000027-0014
Identifier(s)
https://tustorage.ulb.tu-darmstadt.de/handle/tustorage/1600
Publisher
MDPI AG
License
https://creativecommons.org/licenses/by/4.0/
Subject(s)
DDC(s)
621.3