Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper Interconnect

Abdullah AljaafariFaheem AhmedNagih M. ShaalanShalendra KumarAbdullah Alsulami2024-08-142024-08-142023jz000076-0232https://tustorage.ulb.tu-darmstadt.de/handle/tustorage/3858540Enhanced Thermal Stability of Sputtered TiN Thin Films for Their Applications as Diffusion Barriers against Copper InterconnectArticlehttps://doi.org/10.3390/inorganics11050204