Multi-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging

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dc.contributor.authorBoyan Yu
dc.contributor.authorYisai Gao
dc.date.accessioned2024-03-28T11:00:41Z
dc.date.available2024-03-28T11:00:41Z
dc.identifier.urihttps://tustorage.ulb.tu-darmstadt.de/handle/tustorage/1602
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/
dc.titleMulti-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging
dc.typesupplierxml
dspace.entity.typeDistribution
relation.isDatasetOfDistributione63db254-7900-48cd-a59f-803b88eb08c1
relation.isDatasetOfDistribution.latestForDiscoverye63db254-7900-48cd-a59f-803b88eb08c1

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